HeatDesigner

Thermal Design Tool for Electronics

HeatDesigner uses core technology from scSTREAM to perform thermal fluid analysis specifically designed for electronic cooling. HeatDesigner’s performance is optimized for applications that do not require precise reproduction of fine geometrical curvature to predict an accurate flow field. However, HeatDesigner is capable of accommodating meshes with over one hundred million elements, enabling it to capture fine geometrical details. Like scSTREAM, the major advantages of HeatDesigner are fast calculation times and low memory consumption.

Software Features:

-User-friendly Condition Wizard 

Using a structured mesh, models can quickly and easily be converted into a computational domain without the needed model preparation that is typical of an unstructured mesh.

-Reduced Need for Geometry Cleaning

Using a structured mesh, models can quickly and easily be converted into a computational domain without the needed model preparation that is typical of an unstructured mesh.

-Robust and Near-instantaneous Meshing

scSTREAM uses a structured Cartesian mesh. Structured meshes are composed of many small cuboids, so it is very easy and quick to construct. In applications where attention to tiny details and curved surfaces do not have a strong effect on the simulation a structured mesh becomes very beneficial.

-Reduced Computational Time

For a Cartesian mesh, each element face normal are aligned with the axis’s, making the calculation faster by reducing the number of calculations needed to determine the flux.

-Moving Mesh

Flow generated from moving objects can be considered during translation, rotation, or elastic deformation of an object. The mesh of the moving object is created separately from the stationary mesh, this makes moving an object large distances computationally inexpensive.

-Electronic Parts Maker

A tool specifically designed to create precise electrical circuit components. After specifying design parameters, Electronic Parts Maker can consider various semiconductor packages such as: QFP, SOP, and BGA. Both Delphi and Two-Resistor modeling are also included.